Intel and Semtech collaborate to develop LiDAR technology

20 May 2021

Semtech providing laser driver and transimpedance amplifier elements to support Intel’s RealSense LiDAR Camera L515.

Technology giant Intel has announced a collaboration with semiconductor hardware and software developer Semtech to develop optical semiconductor platforms for LiDAR.

Semtech says its laser drivers and programmable transimpedance amplifiers are being integrated into Intel’s RealSense LiDAR Camera L515, “enabling the creation of a power-efficient, high resolution consumer LiDAR.”

The partners’ announcement adds, “The collaboration between Intel RealSense technology and Semtech’s Signal Integrity Products Group has focused on enabling the L515 camera to work in low signal-to-noise ratio environments.

The TIAs feature low input referred noise, which allows the L515 to be a power-efficient, high-accuracy LiDAR system at a resolution of up to 23 million depth points per second.”

Gary Beauchamp, Executive Vice President and General Manager for Semtech’s Signal Integrity Products Group, commented, “We have been working with Intel on LiDAR for several years, and Semtech already has two generations of LiDAR chips in production. In addition, we are developing future chipsets together for deployment in this exciting market.”

The L515 leverages the Semtech TIA’s high bandwidth to deliver high-precision depth and less than 16mm error at the maximum operating range. Coupled with high frequency laser modulation, the L515 can sense objects as small as 7mm in diameter at a distance of one meter.

“Intel’s RealSense technology has been used to develop products and solutions for use in robotics, logistics, scanning and other computer vision applications,” said Sagi BenMoshe, Chief Incubation Officer, Corporate Vice President and General Manager, Emerging Growth and Incubation Group at Intel.

“The Intel RealSense LiDAR Camera L515 using Semtech’s TIA technology delivers unparalleled precision and is the world’s smallest, high-resolution LiDAR depth camera, making it suitable for a variety of use cases.”

Flir’s new thermal cameras enable efficient data analysis for diverse apps

Thermal camera developer Teledyne Flir, which has been rebranded since the completion of the acquisition, announced earlier this week, says its newly-released A50 and A70 thermal cameras are designed for diverse applications from manufacturing to utilities to science.

The model A50 and A70 cameras are specified to offer “improved accuracy” of ±2 °C or ±2% temperature measurement, compared to the previous models’ accuracy of ±5 °C, or ±5% temperature measurement. The cameras feature an IP66 rating, along with a small, compact size with higher resolution options.

Featuring a thermal resolution of 464 x 348 (A50) or 640 x 480 (A70), users can deploy the cameras in a variety of capacities. These include condition monitoring programs to maximize uptime and minimize cost through planned maintenance, or when used in early fire detection applications.