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23 Aug 2024
Optical assembly based around spatial light modulator provides four-fold boost in resolution.
Massachusetts-based optics and display technology developer Kopin says it has received the first volume production order for a new microdisplay assembly based around a spatial light modulator (SLM) for use in high-end inspection.
The high-resolution (4 megapixel) "2K-R11" system, which uses reflective ferroelectric liquid crystal on silicon (FLCoS) technology, is set to be deployed in three-dimensional automated optical Inspection (3D AOI) machines.
Measuring smaller features
Kopin, which has produced optical solutions for this kind of application for more than a decade, describes the tools as essential for modern-day production facilities where semiconductors, printed circuit boards, or other high-tech devices are manufactured.
“While 2D AOI systems can only capture and analyze the top surface of an object, 3D AOI systems measure and evaluate the height and depth of components and quickly inspect and measure deformations, defects or misplaced components, which equates to maintaining essential quality at high speeds,” explains the firm.
“Most existing 3D AOI structured light projection systems typically offer a resolution of 1K x 1K (1 megapixel); but the 2K-R11 elevates this standard by providing four times the resolution, which means expanding the applications for 3D AOI into the measurement of new, smaller feature size components and connectors.”
Quality control
Greg Truman, Kopin’s VP of business development in Europe and Asia, added: “3D AOI systems are expanding in use in sophisticated electronics manufacturing environments, such as for electric vehicle components, because they offer fast and precise identification of flaws that might be overlooked by human inspectors.
“This provides better quality and saves time and money. We believe that as the world continues to evolve to a digital environment the need for high-quality manufacturing of complex circuit boards will continue to increase.”
Truman suggests that the demand for such inspection tools is set to grow rapidly in the near future, quoting an estimate that the market for 3D AOI systems will rise from $700 million a few years ago to $3 billion by 2030.
Kopin says that its 2K-R11 sub-assembly can be easily “dropped” into the design of 3D AOI systems, offering fast, high-fidelity performance alongside high resolution.
“We believe this enhanced resolution paves the way for advanced 3D AOI applications, including the precise measurement of Land Grid Arrays (LGA), Wafer Level Packaging (WLP) and other integrated circuits,” stated the company.
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